Board development

Please let me handle from design to manufacture testing equipment, an evaluation technology, the evaluation board by the engineer who understood a target LSI product, a performance board for tests, a design of a lot of probe cards.

Board design and development supported product

  • Board design
    • Evaluation board
    • Test board
    • Burn-In Board
    • Microcomputer board,Others
  • Board production
  • Part procurement / implementation (machine implementation)
  • Design, production of the IC socket
  • Others, design production of Tools
Board production (SPEC)
Size 600 x 480mm (575 x 575mm)
Number of the Maxicimum layer 60
Board thickness 8mm
Smallest L/S 25μm/25μm
Diameter of the smallest hole φ 0.1mm (through hall plating)
Substrate material FR-4, FR-5, BT resin, strange poly halogen-free, others
Surface treatment Electrolysis, the electroless gilding, solder leveller, flux
Special specifications Impedance control
I bury resin (PAD ON VIA)
Build up board

We cooperate with seven companies (one foreign country) in the country as a cooperation factory of the board production.


Copyright © 株式会社エリア All Rights Reserved.
Powered by WordPress & BizVektor Theme by Vektor,Inc. technology.